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电铸Ni-SiC金属基复合材料的抗拉强度与微观结构分析

The Analysis of Tensile Strength and Microstructure of Ni-SiC Composites Prepared by Electroforming

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【作者】 刘磊赵海军胡文彬沈彬

【Author】 LIU Lei,ZHAO Hai-jun,HU Wen-bin,SHEN Bin(State Key Lab.of Metal Matrix Composites,Shanghai Jiaotong Univ., Shanghai 200030,China)

【机构】 上海交通大学金属基复合材料国家重点实验室上海交通大学金属基复合材料国家重点实验室 上海200030上海200030

【摘要】 在氨基磺酸镍镀液中电铸制备了两种不同SiC微粒含量的复合材料,研究了热处理对复合材料的抗拉强度和微观组织的影响.研究表明,300℃热处理提高了两种复合材料的强度;但600℃热处理却降低了强度.基体金属Ni与SiC颗粒在600℃完全反应后,界面反应产物是Ni3Si、游离石墨和少量的Ni31Si12,并且产生相当于SiC微粒体积8%的微孔.断裂过程经历微裂纹萌生、长大和聚集,以基体断裂、界面脱粘和微粒断裂三种方式进行.

【Abstract】 Ni-SiC metal matrix composites with two kinds of SiC content were prepared by electroforming in a nickel sulphamate bath.The effect of heat treatment on tensile strength and microstructure of Ni-SiC composites were investigated.The heat treatment at 300℃ increases tensile strength,but the heat treatment at 600℃ decreases the tensile strength.The complete reaction between nickel and SiC particles can produce shrinkage pores in the interface.In addition,the volume of shrinkage pores is equal to 8% of that of SiC particles in the composites.The interfacial reaction products are composed of Ni3Si and a little(amount) of Ni31Si12 at 600℃.The fracture process includes microcracks initiation,growth,and coalescence.The cracking of the matrix,debonding of Ni-SiC interface and cracking of particles are three types of cracking modes.

【基金】 国家高技术研究发展计划(863)项目(2002AA334010);上海市科委重点新材料项目(035211037);上海市科技发展基金项目(0211nm052)
  • 【文献出处】 上海交通大学学报 ,Journal of Shanghai Jiaotong University , 编辑部邮箱 ,2006年01期
  • 【分类号】TB331
  • 【被引频次】10
  • 【下载频次】310
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