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电铸Ni-SiC金属基复合材料的抗拉强度与微观结构分析
The Analysis of Tensile Strength and Microstructure of Ni-SiC Composites Prepared by Electroforming
【摘要】 在氨基磺酸镍镀液中电铸制备了两种不同SiC微粒含量的复合材料,研究了热处理对复合材料的抗拉强度和微观组织的影响.研究表明,300℃热处理提高了两种复合材料的强度;但600℃热处理却降低了强度.基体金属Ni与SiC颗粒在600℃完全反应后,界面反应产物是Ni3Si、游离石墨和少量的Ni31Si12,并且产生相当于SiC微粒体积8%的微孔.断裂过程经历微裂纹萌生、长大和聚集,以基体断裂、界面脱粘和微粒断裂三种方式进行.
【Abstract】 Ni-SiC metal matrix composites with two kinds of SiC content were prepared by electroforming in a nickel sulphamate bath.The effect of heat treatment on tensile strength and microstructure of Ni-SiC composites were investigated.The heat treatment at 300℃ increases tensile strength,but the heat treatment at 600℃ decreases the tensile strength.The complete reaction between nickel and SiC particles can produce shrinkage pores in the interface.In addition,the volume of shrinkage pores is equal to 8% of that of SiC particles in the composites.The interfacial reaction products are composed of Ni3Si and a little(amount) of Ni31Si12 at 600℃.The fracture process includes microcracks initiation,growth,and coalescence.The cracking of the matrix,debonding of Ni-SiC interface and cracking of particles are three types of cracking modes.
【Key words】 electroforming; Ni-SiC composite; tensile strength; microstructure; interfacial reaction; fracture;
- 【文献出处】 上海交通大学学报 ,Journal of Shanghai Jiaotong University , 编辑部邮箱 ,2006年01期
- 【分类号】TB331
- 【被引频次】10
- 【下载频次】310