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电场作用下铜渣中金属铜滴迁移行为的研究

A STUDY ON SETTING BEHAVIOR OF COPPER DROPS IN COPPER SLAG UNDER ELECTRIC FIELD

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【作者】 方立武洪新李长荣陈华

【Author】 Fang Liwu Hong Xin Li Changrong Chen Hua(Shanghai Iron and Steel Metallurgy Key Laboratory,Shanghai University)

【机构】 上海大学上海市钢铁冶金重点实验室上海大学上海市钢铁冶金重点实验室 上海200072上海200072

【摘要】 研究了电场作用下铜渣中铜滴的电毛细活动迁移行为。实验结果表明:正极区几乎没有金属铜滴的存在,大量金属铜向阴极区富集迁移,最高富集率达到80%以上。方差分析显示:在富集率的影响因素中,渣料中铜含量的影响最为显著(置信概率为0.95),其次为外加电压和通电时间(置信概率为0.75),而温度影响的显著性最低。并通过模式识别找出了样本聚类的分布规律和提高富集率的优化方向,还进行了相应的实验验证。

【Abstract】 The electrocapillary motion setting behavior of copper drops in slag under the effect of electric field was studied.The results showed that lots of copper drops concentrated on cathode but only minute quantity of copper drop on anode,and the maximum rate of concentration were above 80 %.The result of variance analysis showed that the affection of copper content in slag was most obvious(with the probability of confidence 0.95);the affection of voltage and electrified time ranked as second place(with probability of confidence 0.75);the temperature affection seemed as the weakest.With the help of Pattern-Recognition-Method the accumulation law of samples and the optimized direction for best concentration rate was found,and relevant experiments were made for certification.

  • 【分类号】TF811
  • 【被引频次】17
  • 【下载频次】218
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