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室温磁制冷材料Gd与Cu的真空扩散焊工艺
Study on the Vacuum Diffusion Bonding Technics between Magnetic Refrigerant Material Gd at Room-temperature and Cu
【摘要】 针对室温磁制冷材料Gd本身导热系数低特点,提出了采用真空扩散焊方法改善Gd导热性能的成型工艺方案,在温度为550~620℃,压强为12~20Mpa,保温时间为30~120min条件下,实现了钆和铜异种材料连接,并比较了在钆基体上溅射一层铜薄膜和不溅射薄膜两种条件下的工艺性能。结果表明,溅射对钆基体无明显的影响,同时铜的加入对钆的磁性能影响很小,可忽略不计,本工艺方案切实可行。
【Abstract】 Aiming at the laigh thermal conductivity of magnetic refrigerant materials(such as Gd),this paper presents a new technical scheme named vacuum diffusion bonding,which can improve its thermal conductivity.The results indicate that under the condition of temperature ranging from 550 ℃ to 620℃ in holding time ranging from 30 min to 120min and a pressure ranging from 12 Mpa to 20Mpa,both Gd and Cu can effectively bond together.The outcome show that the vacuum diffusion bonding is a practical method for this kind of material.
- 【文献出处】 西华大学学报(自然科学版) ,Journal of Xihua University(Natural Science Edition) , 编辑部邮箱 ,2006年06期
- 【分类号】TG453.9
- 【被引频次】2
- 【下载频次】136