【摘要】 针对国内外在硅微型压阻式压力传感器上的研究进展和产业化情况,从复合弹性元件的设计、芯片微加工工艺、芯片无应力封装和后期动静态标定等方面指出了其深入研究方向,以及产业化存在的问题和相应的对策。更多还原

【Abstract】 The present research status and industrialization situation of ultraminiaturized pressure sensors is reviewed. The problems on design of the multilevel sensing structure, micro-machining process of chips,non-stress packaging of chips and the static and dynamic calibration are proposed. The methods for solving these problems are given. A broad prospect is anticipated with the support of research organization and development plans.更多还原