【摘要】 基于陶瓷板材,完成了一种多芯片基板的设计,讨论了基板上高频信号线的传输线效应、互连延迟引起的时序问题以及串扰等信号完整性问题.根据二端口等效电路理论,提出了建立基板高频互连线Spice模型的方法,为芯片-封装协同设计提供了依据.更多还原

【Abstract】 Based on ceramic material,a kind of MCM substrate is designed.The problems about signal integrity such as the transmission line effect of high-frequency signal lines,the time sequence caused by interconnection and cross talk are discussed.Finally,a method of building the Spice model with high-frequency interconnection line in the substrate is proposed,thus providing a foundation for coordination design of chip package.更多还原