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低温快速热退火晶化制备多晶硅薄膜
Preparing polycrystalline silion thin film by rapid thermal annealing(RTA) at lower temperature
【摘要】 利用PECVD设备沉积非晶硅薄膜,然后放入特制的快速热退火炉中进行退火。利用X射线衍射仪(XRD)分析退火后的薄膜晶体结构,用电导率测试仪测试其暗电导率。研究结果表明,利用快速热退火晶化能够使非晶硅薄膜在较低温度下,在较短时间内发生晶化。
【Abstract】 The a-Si∶H thin films were deposited by PECVD and then were annealed in tailor-made RTA furnace.The microstructure and electric property of thin films were investigated by XRD and dark conductivity measurements.The results show that a-Si:H thin films had been annealed at lower temperature and shorter time by rapid thermal annealing(RTA).
【关键词】 快速热退火;
非晶硅薄膜;
暗电导;
【Key words】 rapid thermal annealing(RTA); amorphous silicon thin film; dark conductivity;
【Key words】 rapid thermal annealing(RTA); amorphous silicon thin film; dark conductivity;
- 【文献出处】 可再生能源 ,Renewable Energy , 编辑部邮箱 ,2006年03期
- 【分类号】TN304.05
- 【被引频次】9
- 【下载频次】373