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有限厚中心圆孔板的最大三维应力集中
Three-dimensional Stress Concentration at Circular Holes in Finite Thickness Plates
【摘要】 应用有限元法对有限厚中心圆孔板的三维应力集中进行了分析。分析发现,当板厚是孔半径的2.4倍时,出现最大应力集中,若此时采用总厚度与其相等的系列分层板来代替整板,将有效地降低三维应力集中;对于厚板,最大应力集中总是出现在离自由表面1.2倍孔半径的位置。分析得到最大三维应力集中系数与相应平面解之间的近似关系;在缺口系数的基础上,研究了三维应力集中对疲劳强度的影响,并给出一个三维应力集中对疲劳强度的影响系数。
【Abstract】 The three-dimensional stress concentration(SC) along the walls of circular holes in finite thickness plates has been analyzed by using the finite element(FE) method.The SC arrives at maximum value when the ratio of thickness to radius of the holes equals 2.4.It can be reduced when the plates are replaced by layered-plates that are as thick as the plates.As for a thick plate,the maximum SC always occurs at a position which is 1.2 times radius of a hole away from its free surface.The approximate relationship between the maximum three-dimeusional SC factor and its corresponding planar solution was obtained;the influence of the SC on fatigue strength was studied and a factor of influence was also presented.
【Key words】 stress concentration; circular hole; fatigue strength; layered-plate;
- 【文献出处】 机械科学与技术 ,Mechanical Science and Technology , 编辑部邮箱 ,2006年04期
- 【分类号】O343.4
- 【被引频次】9
- 【下载频次】435