【摘要】 采用半导体激光软钎焊系统对Sn63Pb37和Sn96Ag3.5Cu0.5焊膏在铜基板上的润湿铺展性能进行了试验,研究了不同激光加热时间对钎料润湿铺展性能的影响,采用扫描电镜分析了Sn63Pb37和Sn96Ag3.5Cu0.5钎缝的显微组织和钎缝界面区组织特征。结果表明,在一定的激光输出功率下,随着激光加热时间的增加,两种钎料的润湿性都得到提高。其中Sn-Pb钎料焊膏的加热时间达到1.5 s时,润湿面积和润湿角趋于稳定,而Sn-Ag-Cu钎料焊膏润湿性需要达到2.5 s时润湿面积和润湿角才趋于稳定。更多还原

【Abstract】 Diode laser soldering system was used to study and explore the ways to improve the wettability and spreadability of Sn63Pb37 paste solder and Sn96Ag3.5Cu0.5 lead-free paste solder on Cu substrate.The effects of heating time of the laser on the wettability of paste solders were investigated and it was also analyzed that the microstructures of the joints and interfacial region of Sn63Pb37 and Sn96Ag3.5Cu0.5 under different time conditions by means of SEM.The Results indicate that the wettability and spreadability of the two kinds of solders on Cu substrate are improved with the increase of heating time under the condition of selected laser output power.When the heating time is longer than 1.5 s,the spreading area and wetting angle of Sn63Pb37 solder are tending towards stability and when the heating time is longer than 2.5 s,the spreading area and wetting angle of Sn-Ag-Cu solder are tending towards stability as well.更多还原