【摘要】 采用半导体激光软钎焊和红外再流焊方法对QFP32和QFP48两种不同结构尺寸的器件引线进行了钎焊性试验,针对使用Sn-Pb和Sn-Ag-Cu两种不同成分钎料所得到的QFP器件焊点,采用微焊点强度测试仪研究了其抗拉强度的分布规律,并采用扫描电子显微镜分析了焊点断口的显微组织特征。结果表明,同种QFP器件焊点的抗拉强度,半导体激光软钎焊焊点明显高于红外再流焊焊点抗拉强度,QFP48器件焊点抗拉强度明显高于QFP32器件焊点的抗拉强度。半导体激光焊QFP器件焊点的断裂方式为韧性断裂,红外再流焊焊点断裂方式兼有脆性断裂和韧性断裂的特征。更多还原

【Abstract】 Soldering experiments of two kinds of devices QFP32 and QFP48 were carried out using diode-laser soldering system and IR reflow soldering method,and the distribution regulations of the tensile strength of QFP micro-joints with Sn-Pb solder and Sn-Ag-Cu lead-free solder were studied by STR-1000 micro-joints tester, and the characteristics of fracture microstructures of micro-joints were also analyzed by SEM. The results indicate that tensile strength of QFP micro-joints soldered with laser soldering system is larger than that with IR reflow soldering method,and tensile strength of QFP48 micro-joints is larger than that of QFP32 micro-joints. Fracture mechanism of micro-joints soldered with laser soldering system is toughness fracture, while fracture mechanism of micro-joints soldered with IR reflow soldering method includes brittle fracture and toughness fracture.更多还原