【摘要】 环氧树脂灌封胶在电子电器工业领域应用广泛。单组分环氧树脂灌封胶在使用工艺和性能方面都优于双组分灌封胶,其关键技术是开发潜伏性的固化剂。用苯胺衍生物对双氰胺进行改性,制得了一种新型潜伏性固化剂。该固化剂与环氧树脂最佳配比为25／100,在140℃可快速固化,室温下贮存期在100 d以上。更多还原

【Abstract】 The epoxy resin sealant has extensive application in the electronic and electrical equipment industry. The one pakeage epoxy resin sealant is more excellent than the double pakeage in both the use craft and the performance and its critical technology is develop is more excellent than of latent curing agent. A new latent curing agent was obtained by modifying dicyandiamide with aniline derivative. The optimal ratio of curing agent to epoxy resin is 25/100. It can be cured quickly at 110℃and the reserve time can be above 100 days at room temperature.更多还原