【摘要】 对无铅焊接技术的产生背景、国内外发展现状,以及由于焊接温度、焊点外观、金相组织等变化而带来的问题及其解决方法和途径,影响应用的有关因素等进行了探讨.对无铅焊接技术应用中的无铅焊料选择、元器件选定、印制电路板(PCB)应用设计、再流焊温度曲线改善、氮气保护再流焊、工艺控制与优化等进行了具体分析和研究.更多还原

【Abstract】 The research aims at the problems in the recent development and its background both at home and abroad of lead-free soldering technology and its advantages,such as non-pollution,changes of temperature,changes of solder joints figuration,changes of metallography organization.The basic methods to deal with the corresponding problems and factors which affect its applications are discussed.Some influencing factors of application of lead-free soldering technology are investigated,such as choice of lead-free solder and components,application design of PCB,improvement of reflow soldering temperature curve,reflow soldering by nitrogen protection,optimization of technology.更多还原