节点文献
倒装结构大功率蓝光LEDs的研制
Rresearch and Fabrication of Flip-chip High-power Blue LEDs
【摘要】 从器件制作角度入手,对基于III族氮化物的功率型蓝光LEDs结构和电极体系进行了优化设计。采用梳状结构、高反电极体系及倒装焊技术,研制出大功率蓝光LEDs,在350 mA工作电流下,工作电压为3.3~3.5 V,输出功率达137.71 mW,反向5 V电压下的漏电流小于1μA。
【Abstract】 The design of group III-nitride based blue light emitting diodes(LEDs) has been optimized.LEDs are fabricated by using finger-design and highly reflecting metallizations as ohmic contacts and optical reflectors.LEDs flip chip having output power as high as 137.71 mW for a current of 350 mA with operating voltage typically 3.3~3.5 V has been demonstrated.The leakage current is less than 1 μA at a reverse voltage of 5 V.
【关键词】 大功率;
LEDs;
梳状结构;
高反电极;
倒装结构;
【Key words】 high-power; light emitting diode(LEDs); finger-design; reflective-P-metal; flip-chip;
【Key words】 high-power; light emitting diode(LEDs); finger-design; reflective-P-metal; flip-chip;
- 【文献出处】 光电子·激光 ,Journal of Optoelectronics.laser , 编辑部邮箱 ,2006年06期
- 【分类号】TN312.8
- 【被引频次】9
- 【下载频次】136