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Ni3Al基高温合金瞬态液相扩散连接过程中元素扩散行为研究
Study on Element Diffusion Behavior in TLP Bonding Process of Ni3Al Based HT Alloy
【摘要】 研究了采用3种不同中间层合金瞬态液相扩散连接Ni3Al基合金过程中,中间层合金与母材之间的元素相互扩散行为。结果表明,对于不含Al元素的中间层合金,母材中的Al向焊缝的溶解扩散是控制焊缝中γ′相析出的决定因素。中间层合金中加入Mo、Co、W等元素后使Al的扩散明显减慢,焊缝中元素扩散均匀化的时间显著加长。
【Abstract】 The element diffusion behavior between base metal and the filler metals in the TLP bonding process of Ni3Al based alloy using three different filler metals was studied.It was shown that for filler metals without Al,the Al content diffused by the dissolution of the base metal was the key factor that controlled the precipitation of γ’ in the bonding seam.When Mo,Co and W was added in the filler metals,the diffusion rate of Al was slowed tremendously,and more time was needed for the homogenization of the bonding seam.
- 【文献出处】 电站系统工程 ,Power System Engineering , 编辑部邮箱 ,2006年03期
- 【分类号】TG457.19
- 【被引频次】2
- 【下载频次】230