【摘要】 为了适应半导体器件的高可靠要求,对Au-Al键合抗温变应力性能进行了考核。试验结果表明,Au-Al键合具有较好的抗热疲劳性能,键合界面处无裂纹产生,且机械性能良好。然而试验中的高温应力导致金铝间形成了电阻率较高的化合物Au5Al2,引起键合失效。并对目前工艺水平下的Au-Al键合可靠性进行了评价,预测了键合寿命。更多还原

【Abstract】 The resistance to thermal shock of gold-aluminum bonding has been tested with high reliability requirement of semiconductor devices.No crack has been observed in the bonding interface and mechanical property was relatively favorable,which indicated that the resistance of Gold-Aluminum bonding to thermal fatigue damage is good.It’s high temperature that resulted in the formation of high-resistivity Gold-Aluminum intermetallics and led to bonding failure.Besides,Gold-Aluminum bonding reliability has been evaluated and bonding life has been calculated approximately.更多还原