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Sn-8Zn无铅钎料性能的研究

Study of Sn-8Zn Lead-free Solder Weldability

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【作者】 商延赓郎波孙大千吴文云黄泽武

【Author】 SHANG Yan-geng,LANG Bo,SUN Da-qian,WU Wen-yun,HUANG Ze-wu(JiLin University,Changchun 130022,China)

【机构】 吉林大学吉林大学 吉林长春130025吉林长春130025

【摘要】 研究了不同微量合金元素(B i、Ag)对Sn-8Zn无铅钎料高温抗氧化性能及接头剪切强度的影响,采用氧化质量增加Δm值的方法,在高温下观察钎料表面氧化膜形状和颜色的变化并对氧化膜进行X射线衍射分析,探讨了钎料的高温抗氧化性能的机理,通过对钎料的金相显微组织观察和对热处理后钎焊接头的剪切强度试验,分析了提高接头剪切强度的原因。试验结果表明:在Sn-8Zn钎料中加入适量的合金元素(B i、Ag)均可以改善和提高钎料的高温抗氧化性能和接头的剪切强度。

【Abstract】 The effects of alloy elements Bi and Ag on the resistance to oxidability and joint shear strength of Sn-8Zn lead-free solder at high-temperature was studied.At high-temperature the change of oxidation film shape and color was observed on the surface of liquid solder by oxidation weight increase △M value method.We analyzed oxidation film by X-ray diffraction analysis and studied high-temperature resistance to oxidability of solder.The reasons of advancing observations of solder structure and joint shear strength were analyzed by experiments of solder joint shear strength after heat treatment.The experimental results indicated that the appropriate addition of alloy elements Bi and Ag could enhance resistance to oxidability at high-temperature and joint shear strength.

【基金】 吉林省科技发展计划项目(项目编号:20000518)
  • 【文献出处】 电子工艺技术 ,Electronics Process Technology , 编辑部邮箱 ,2006年04期
  • 【分类号】TG425
  • 【下载频次】139
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