【摘要】 采用润湿平衡法,研究了水溶性钎剂条件下SnAgCu系钎料合金对表面贴装元件的润湿特性。试验结果表明,钎焊温度对润湿力作用显著。Sn2.5Ag0.7Cu钎料合金的最大润湿力为1.265 mN,其最佳工艺参数分别为:预热时间15 s,钎焊温度255℃和钎焊时间5 s。该润湿力高于目前商用的Sn3.0Ag0.5Cu钎料,与Sn3.8Ag0.7Cu钎料润湿力相当,完全能够满足表面组装行业对无铅钎料润湿性能的要求。更多还原

【Abstract】 The wetting property of SnAgCu solder alloy on Surface Mount Component by adopting water-soluble flux is researched by wetting balance method.The experiments show that soldering temperature play the most important role on wetting force.The maximum wetting force of Sn2.5Ag0.7Cu is 1.265 mN and its optimum soldering processing parameters are:preheating time 15 s,soldering temperature 255 ℃ and soldering time 5s.The wetting force of Sn2.5Ag0.7Cu is higher than that of commercially used Sn3.0Ag0.5Cu solder and is in the same level of that of Sn3.8Ag0.7Cu,which can meet the wetting property standard to the lead-free solders of Surface Mount Technology industry.更多还原