【摘要】 随着人们对环境的日益重视和电子封装组装技术的发展,合金焊料的无铅化和质量的要求也越来越高,开发无铅、无毒焊料成为焊料开发的重要方向。介绍了无铅焊料的应用现状及无铅的使用要求,并论述了几种无铅焊料Sn-Ag、Sn-Zn、Sn-B i系的特点,以及添加其它元素对它们综合性能的影响。更多还原

【Abstract】 Recently environment is paid more and more attention and with the development of microelectronic industry the demand of the quality of lead-free solder is higher and higher,developing no-lead and no-poison solder is important.Discuss the application and requirement of the lead-free solder,which covers Sn-Ag,Sn-Zn,Sn-Bi and so on,meanwhile,discuss the effect of other element in those three solders.更多还原