【摘要】 基于Protel 99 SE在高频PCB(印制电路板)设计与制作过程中,从高频PCB的布局、布线、焊盘及敷铜几个方面对散热、EMC(电磁兼容)、EM I(电磁干扰)及PCB的可制造性等问题进行研究,探讨了解决问题的技巧及方法。实践结果表明,在实际高频PCB设计与制作中取得了很好的效果。更多还原

【Abstract】 This study aims at resolving some technical problems such as radiated heat,EMC, EMI and processing in the design of High Frequency PCB based on Protel 99 SE for overall configuration and connection layout.In addition,some suggestions were given to its manufacturing process including the pads and the copper spreading.The results of practice showed that all suggested techniques work well.更多还原