【摘要】 无铅焊料的研发及专利权的保护是我国电子行业亟待解决的问题。文中结合中国专利权的特点,描述了世界各国在无铅焊料专利上的竞争以及Sn-Zn无铅焊料的专利申请状况,并据此分析了Sn- Zn无铅焊料的研发及应用状况、专利Sn-Zn无铅焊料的特点以及应用障碍,以期对我国自主知识产权的Sn-Zn无铅焊料的研发及无铅专利保护有所帮助。更多还原

【Abstract】 It is urgent for electronic material industry to research and develop lead-free solders and protect patent of lead-free solders.Combined the characteristics of China patent,this paper described the competition of lead-free solders all over the world and application status of Sn-Zn lead-free solders analyzed the devel- opment and application of Sn-Zn lead-free solders,characteristics and application obstacle of Sn-Zn lead-free solders applied patent,It expect to contribute to develop self intellectual property Sn-Zn lead-free solders and protect patent of lead-free solders in China.更多还原