【摘要】 以5 W/20 K小型G-M制冷机为冷源,对低温下氮化铝(A lN)与无氧铜(OFHC)界面的接触热导进行了实验研究和分析。在45~140 K内,氮化铝/无氧铜界面接触热导随温度的升高而增大,同时亦随接触压力的增加而增大。实验中同时得到了氮化铝在低温下的热导率,随温度的升高,氮化铝热导率值逐渐增大。就氮化铝低温热导率及氮化铝/无氧铜接触界面热阻随温度变化规律进行了微结构机理分析。更多还原

【Abstract】 The thermal conductivity of ceramic AlN and the thermal contact conductance（TCC）between AlN and OFHC under the low temperature（45¹40 K）and the vacuum(10^-310^-4 Pa)had been measured using the axial steady heat flow method on the G-M cryocooler with 5 W/20 K capacity.Investigation shows that the TCC of AlN/Cu interface increases as the contact temperature and pressure increase,and the conductivity of ceramic AlN increases as the temperature rises.An analysis based on micro and nano structural cryogenic concept was made for explaining the change of thermal conductivity of AlN and the thermal contact conductance of AlN/Cu interface.更多还原