【摘要】 研究了Sn-8Zn-3B i-xP钎料的抗氧化性、熔点、组织及力学性能.热重分析表明:P元素的加入显著降低了钎料熔体表面的氧化量;采用俄歇能谱分析氧化层的成分和厚度,发现含P的钎料表面形成的ZnO层厚度明显降低,约为80 nm;对合金进行差热分析发现少量P的加入并不改变钎料的熔点和熔程;P的加入对钎料合金的强度几乎没有影响,但却降低了合金的塑性,这是因为含P合金中有粗大的富Zn相形成,断口分析显示在Zn相与Sn相晶界上容易出现裂纹,从而导致钎料的塑性下降.更多还原

【Abstract】 The oxidation resistance,melting point,microstructures,and mechanical properties of Sn-8Zn-3Bi-xP solders were investigated.The results show that minute amount of phosphorus can significantly improve the oxidation resistance of Sn-8Zn-3Bi lead-free solders.Auger electron spectrometer(AES) analysis reveals that the depth of oxidation in Sn-8Zn-3Bi alloys can be reduced by adding a little phosphorus.With additional alloy element phosphorus,the depth of oxidation is about 80 nm.Small amount of phosphorus has no obvious influence on the melting point and the pasty range of Sn-8Zn-3Bi solders.The primary Zn phase appears in the matrix of P-contained alloys.Cracks are apt to occur along the interfaces of the primary Zn phase and Sn phase,which causes deterioration of elongation of the alloys.更多还原