【摘要】 化学镀锡主要包括还原法化学镀锡、歧化反应化学镀锡和浸镀法化学镀锡,总结了3种方法的优缺点及反应机理。还原法化学镀锡和歧化反应化学镀锡的镀液稳定性差;浸镀法化学镀锡的镀液稳定性好,镀层厚度均匀,其沉积过程分为置换反应期、铜锡共沉积与自催化沉积共存期和自催化沉积期。化学镀锡工艺在微电子行业具有很好的应用前景。更多还原

【Abstract】 The methods of electroless tin plating include processes based on reduction,disproportionation and repla-cement reactions.The advantages and disadvantages and reaction mechanisms of the above methods were summarized.The plating baths based on reduction and disproportionation reactions have poor stability while the replacement-based bath is stable,and the deposit has uniform thickness.The deposition process with replacement reaction includes repla-cement reaction period,copper-tin codeposition and autoca-(talytic) deposition coexisting period,autocatalytic deposition period.The process of electroless tin plating has wide applications in microelectronic filed.更多还原