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SnAgCuY系稀土无铅钎料显微组织与性能研究
Studies on Microstructure and Performance of SnAgCuY Lead-Free Solders Doped with Rare Earth Y
【摘要】 研究了添加微量稀土Y对Sn3．8Ag0．7Cu钎料合金显微组织和性能的影响,通过对钎料的熔化温度、润湿性能、接头剪切强度的测试及显微组织观察,指出含微量稀土的SnAgCuY合金是性能优良的无铅钎料合金,同时确定了最佳的Y含量范围。
【Abstract】 In the present paper the effect of trace amount rare earth Y on the microstructure and the performance of Sn3.8Ag0.7Cu solder alloy has been systematically investigated Through measurement of melting temperature, wettability and joint shear strength, and observation of microstructure, it is indicated that the SnAgCuY alloy containing rare earth Y is a lead-free solder with excellent performances. At the same time the best content of Y was determined.
【基金】 国家863高技术项目资助(No．2002AA322040)
- 【文献出处】 稀有金属材料与工程 ,Rare Metal Materials and Engineering , 编辑部邮箱 ,2006年S2期
- 【分类号】TG425
- 【被引频次】28
- 【下载频次】204