【摘要】 以高温合金DD3为基材,利用电镀工艺得到10μm的Pd镀层,然后在1050℃分别做4h和14h真空热处理,以研究Pd镀层的阻扩散行为。XRD和SEM/EDS的分析结果表明,电镀后的DD3表面得到的是单一的Pd镀层,但经过1050℃,4h和14h的真空热处理之后,基体中的元素如Al,Cr,Co和Ni等会通过Pd镀层扩散到表面,说明Pd镀层本身不能作为阻止基体元素扩散的涂层用于DD3的基体之上。更多还原

【Abstract】 Adopting electroplating process,a 10 μm palladium film was prepared on DD3 substrate.To examine the possibility of the palladium film used as the anti-diffusion layer between the bond coating and the substrate in the thermal barrier coating system,the 4 h and 14 h vacuum heat treatment at 1050℃ was carried out.The SEM/EDS study and the XRD analysis show that after vacuum heat treatment,the elements such as Al,Cr,Co,Ta and Ni diffuse outwards to the coating surface.And PdAl,α-Al2O3,and TiO2 are formed on the coating surface even under the vacuum condition.So Palladium film itself can not be used as the anti-diffusion layer between the substrate and the bond coating.更多还原