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水分在粘接接头界面的扩散系数和动力学
The measurement of water diffusion coefficient and dynamics in adhesive/c-c composites joints
【摘要】 为研究水分在粘接接头界面的扩散行为,采用X射线能谱(EDX)分析方法计算了水分在碳/碳复合材料粘接接头界面的扩散系数和扩散动力学,并比较了水分在不同表面处理方法处理的碳/碳复合材料粘接接头界面的扩散系数和扩散动力学.结果表明,经偶联剂处理的碳/碳复合材料耐久性能要好于化学氧化和砂纸打磨处理,这与剪切强度测试结果相一致.
【Abstract】 EDX analysis method was used to measure the width of adhesive/c-c composites joints interface and its elements content,so the water diffusion coefficient and dynamics in adhesive/c-c composites joints can be calculated.Water diffusion coefficient and dynamics of adhesive/c-c composites joints treated by different surface treatment methods were also researched in this paper.Results indicated that the water diffusion speed in adhesive/c-c composites joints treated by sand paper was faster than that treated by chemical oxidation and by silane couple agent treatment.
【Key words】 diffusion coefficient; dynamics; adhesive/c-c composites joints;
- 【文献出处】 材料科学与工艺 ,Materials Science and Technology , 编辑部邮箱 ,2006年06期
- 【分类号】TG49
- 【被引频次】2
- 【下载频次】142