【摘要】 为研究电子封装用S ip/A l复合材料热物理及力学性能,利用挤压铸造方法制备了体积分数为65%的S ip/LD11(A l-12%S i)可回收环保型复合材料.采用TEM观察、膨胀仪、激光导热综合测试仪以及万能电子拉伸试验机等设备及技术对复合材料进行研究.结果表明:S ip/LD11复合材料组织致密,材料中未观察到孔洞和缺陷;20~50℃时复合材料的热膨胀系数为8.1×10-6/℃,并随着温度的升高而增加,退火处理能够降低复合材料的热膨胀系数;S ip/LD11复合材料铸造状态和热处理状态的热导率分别为132.9、160.1 W/m.℃,复合材料的弯曲强度和比模量较高;可以采用化学镀方法在复合材料表面涂覆N i层,镀层结合强度良好,是一种优异的电子封装用复合材料.更多还原

【Abstract】 A reclaimed environmental-friendly Sip/LD11（Al-12%Si） composite with volume fraction of 65% was fabricated by squeeze casting technology.The thermo-physical and mechanical properties of Sip/Al composite for electronic packaging application were studied by use of TEM observation,thermal expansion analyzer,laser thermal conduction analyzer and tensile test machine.The results show that the composite was free of porosity and the Si particles distributed uniformly.The coefficient thermal expansion of composite reached 8.1×10^-6/℃ from 20 ℃ to 50 ℃ and increased with the temperature,also reduced after annealing.The thermal conductivity of casting and annealing treatment were 132.9 W/m·℃ and 160.1 W/m·℃,respectively.The flexural strength and specific modulus were moderately high.An electroless nickel surface was established on the composite.It is an excellent composite for electronic packaging application.更多还原