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无机基片表面选择性制备铜线路图形
Selective Preparation of Copper Pattern on Glass Substrate
【摘要】 介绍了一种新型的紫外光刻体系,它由包含低分子量PVP(K30)作为稳定剂的钯胶和用作光刻胶的高分子量PVP(K90)/DAS组成。通过紫外光引发DAS分解及PVP交联、乙醇显影和高温处理在玻璃基片的表面选择性固定Pd颗粒,然后通过Pd颗粒引发化学镀,得到铜线路图形。采用扫描电镜(SEM)观察并讨论了显影时间及其对图形分辨率的影响。
【Abstract】 A novel solution containing high-molecular PVP (K90) and DAS, which together function as the photoresist, and low-molecular PVP (K30), which serves to stabilise the palladium, is studied in this paper. Patterns are formed by using UV light through a photomask to induce PVP crosslinking and trapping of palladium. After the development under ethanol, the patterned surface is annealed, leaving only palladium particles on which copper could be deposited through electroless plating. SEM is used to investigate the relationship between pattern resolution and development time.
【Key words】 electroless plating; polyvinylpyrrolidone; palladium; UV photo-lithography; micro-patter;
- 【文献出处】 材料导报 ,Materials Review , 编辑部邮箱 ,2006年11期
- 【分类号】TN405
- 【下载频次】63