【摘要】 单晶表面加工损伤是衡量工艺水平以及单晶片质量的一个主要参数。综述对单晶表面加工损伤进行分析评价的各种方法,对各种分析方法的基本原理、主要特点及应用做了概要介绍。由于单晶表面损伤以及表面残余应力存在一定的梯度及各种表征方法的作用机理、作用深度不尽相同,因此不同的评价方法对同一样品的分析往往会出现差异。根据不同的分析目的,给出了选择分析手段的建议。更多还原

【Abstract】 The surface damages greatly effect the quality of the single crystal wafer. The characterization techniques and methods involved in the assessment of single crystal wafer damages are discussed briefly in this paper, and its features and applications are also presented. For the different interaction principles, results of surface damages analysis obtained by those methods may be discrepant in some degree. According to different analysis purposes, suggestions on how to chose analysis methods are given.更多还原