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粉体化学镀银的研究进展

Progress in Research of Electroless Silver Plating of Powders

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【作者】 梅冰乔学亮邱小林陈建国谈发堂李世涛

【Author】 MEI Bing ,QIAO Xue-liang ,QIU Xiao - lin, CHEN Jian-guo, TAN Fa-tang ,LI Shi-tao (1. State Key Laboratory of Die Technology, Huazhong University of Science and Technology, Wuhan 430074, China;2. Nanomaterial Research Center,Nanchang Institute of Technology, Nanchang 330013, China).

【机构】 华中科技大学模具技术国家重点实验室南昌理工学院纳米材料研究中心华中科技大学模具技术国家重点实验室 湖北武汉430074湖北武汉430074江西南昌330013

【摘要】 介绍了化学镀银工艺中粉体表面预处理的方法,综述了近年来金属粉体、无机粉体和高分子粉体化学镀银的研究和应用状况,分别讨论了3种粉体在化学镀银中的镀液稳定性、粉体表面的催化活性、镀银过程中粉体的分散性及镀层的均匀性等问题,并提出了今后粉体镀银工作的发展方向。

【Abstract】 The progress in the research of electroless silver plating of powders was reviewed. Thus the methods for the pretreatment of powders subjected to electroless silver plating were briefed. The research and application of the electroless silver plating of metallic powders, inorganic powders, and macromolecular powders were summarized. The stability of the plating solution, the surface catalytic activity of the powders, the dispersaney of the powders in the plating bath, and the uniformity of the electroless Ag coating were highlighted with respect to the electroless silver plating of three kinds of powders. Besides, the directions in the future study of silver plating of powders were suggested as well.

【关键词】 化学镀银粉体研究进展
【Key words】 electroless silver platingpowdersresearch progress
【基金】 华中科技大学优秀博士论文基金[(2004)39号]
  • 【文献出处】 材料保护 ,Materials Protection , 编辑部邮箱 ,2006年12期
  • 【分类号】TQ153.1
  • 【被引频次】27
  • 【下载频次】818
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