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无染料酸性镀铜添加剂的发展状况
Review on Current State of Additives for Non-Dye Acidic Copper Electroplating
【摘要】 综述了无染料酸性镀铜添加剂MN系列的发展状况及几类无染料添加剂的优点和不足,比较了无染料系列添加剂与有机染料系列的性能差异,对目前最好的无染料添加剂系列EPI进行了简要的介绍,并展望了未来添加剂的发展方向。
【Abstract】 A review was given on the current state and development of MN series additives for non-dye acidic copper electroplating.The advantages and disadvantages of several types of additives for non-dye acidic electrodeposition of copper were summarized.A comparison was made with respect to the properties of the non-dye additives and dye additives.Moreover,the most widely accepted EPI series additives as representative non-dye additives were briefed,and some suggestions were given with respect to the development and prospect of the additives for copper electroplating.
- 【文献出处】 材料保护 ,Materials Protection , 编辑部邮箱 ,2006年06期
- 【分类号】TQ153.14
- 【被引频次】14
- 【下载频次】331