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无染料酸性镀铜添加剂的发展状况

Review on Current State of Additives for Non-Dye Acidic Copper Electroplating

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【作者】 刘烈炜张艳清杨志强

【Author】 LIU Lie-wei~(1),ZHANG Yan-qing~(1),YANG Zhi-qiang~(2)(1.Department of Chemistry,Huazhong University of Science and Technology,Wuhan 430074,China;2.Wuhan Institute of Materials Protection,Wuhan 430030,China)

【机构】 华中科技大学化学系武汉材料保护研究所 湖北武汉430063湖北武汉430063湖北武汉430030

【摘要】 综述了无染料酸性镀铜添加剂MN系列的发展状况及几类无染料添加剂的优点和不足,比较了无染料系列添加剂与有机染料系列的性能差异,对目前最好的无染料添加剂系列EPI进行了简要的介绍,并展望了未来添加剂的发展方向。

【Abstract】 A review was given on the current state and development of MN series additives for non-dye acidic copper electroplating.The advantages and disadvantages of several types of additives for non-dye acidic electrodeposition of copper were summarized.A comparison was made with respect to the properties of the non-dye additives and dye additives.Moreover,the most widely accepted EPI series additives as representative non-dye additives were briefed,and some suggestions were given with respect to the development and prospect of the additives for copper electroplating.

【关键词】 酸性镀铜添加剂无染料综述
【Key words】 acidic copper electroplatingadditivenon-dyereview
  • 【文献出处】 材料保护 ,Materials Protection , 编辑部邮箱 ,2006年06期
  • 【分类号】TQ153.14
  • 【被引频次】14
  • 【下载频次】331
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