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影响微粒复合沉积的诸因素

Factors Affecting the Codeposition of Particulates in Complex Electroplating

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【作者】 冯秋元李廷举金俊泽

【Author】 FENG Qiu-yuan,LI Ting-ju,JIN Jun-ze(Key Laboratory of Special Processing of Raw Materials,Dalian University of Technology,Dalian 116024,China).

【机构】 大连理工大学原材料特种制备技术重点实验室大连理工大学原材料特种制备技术重点实验室 辽宁大连116024辽宁大连116024

【摘要】 复合镀层中固体微粒的含量决定其硬度、耐腐蚀、抗磨等性能,而影响微粒与基质金属复合沉积的因素很多,如电流密度、微粒表面电荷、温度、pH值、搅拌方式等。介绍了影响复合电镀微粒共沉积的各种因素,分析了诸因素在复合镀层形成过程中所起的具体作用,探讨了微粒与基质金属共沉积的机理。概述了纳米微粒解团聚的方法,指出了今后复合电镀的研究方向。

【Abstract】 A review was given on the factors affecting the codeposition of particulates in composite electroplating.Thus the actions of various factors in the electroplating process were analyzed, the codeposition mechanisms of the particulates and the metallic matrix were discussed,and the methods to get rid of agglomeration of nano-sized particulates in the plating bath were summarized.It was pointed out that the content of the particulates in the electroplated coatings has significant effects on the hardness,corrosion resistance and wear resistance of the composite coatings,while the co-deposition of the particulates and metallic matrix is dependent on many factors such as current density,the surface charge of the particulates,temperature,pH value,and the agitation mode.Meanwhile,a prospect was provided concerning the development trend of composite electroplating.

【基金】 国家自然科学基金资助项目(50474055,50234020)
  • 【文献出处】 材料保护 ,Materials Protection , 编辑部邮箱 ,2006年05期
  • 【分类号】TQ153
  • 【被引频次】26
  • 【下载频次】253
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