【摘要】 在微机械高冲击传感器的测试过程中发现一种传感器芯片的严重失效问题.文中采用薄板弯曲的简化模型对该失效问题进行了初步研究.分析认为该失效是由于高冲击引起封装壳体变形使管芯承受放大了的应力,过大的应力导致芯片某些部位应力超过断裂强度而损坏.改进措施主要是通过完善壳体设计,合理增加厚度或减小壳体尺寸使壳体形变减小,从而减小由此给芯片带来的应力.更多还原

【Abstract】 A kind of failure mode is observed under high shock experiments. The failure mechanism of the microsensors is investigated. We found that the damage is caused by the bending of shell for the package of microstructure. The damage can be avoided by increasing the thickness of the shell and/or decreasing the dimensions of the shell, because they can decrease the stress of microstructure under shock environments.更多还原