【摘要】 衬底触发技术可以大幅度提高大尺寸NMOS器件的ESD级别。将衬底触发技术融合到层叠式NMOS器件中来产生衬底触发层叠式NMOS器件,理论分析结果表明衬底触发技术可以提高混合电压I/O电路中层叠式NMOS器件的ESD稳健性,基于0.35μmCMOS工艺的模拟结果表明应用带有衬底触发技术的层叠式NMOS器件的HBM模型ESD级别提高约60%,这就验证了衬底触发设计对提高混合电压I/O电路的ESD级是有效的。更多还原

【Abstract】 The substrate-triggered technique has an obvious improve on ESD level of the large-dimension NMOS devices. The substrate-triggered stacked-NMOS device that combines the substrate-triggered technique into the stacked-NMOS device is investigated. From the academic results, the substrate-triggered technique can increase ESD robustness of the stacked-NMOS device in the mixed-voltage I/O circuit. From the experimental results in a 0.35 μm CMOS process, HBM ESD level of the proposed ESD protection design by using stacked-NMOS with substrate-triggered technique can be improved up to ~60%. This has verified the effectiveness of the substrate-triggered design to improve ESD level of mixed-voltage I/O circuits.更多还原