【摘要】 根据SD-33粘结剂在升温速率分别为5、10、20 K/m in时的DSC-TG曲线,在20~550℃温度范围对SD-33粘结剂的热分解过程进行了研究,用Coats-R ed fern方法获得SD-33粘结剂的热分解动力学参数和机理函数。结果表明,在不同升温速率的TG曲线上,SD-33粘结剂热失重开始温度大致相同,而热失重结束温度随升温速率的增大而升高。同时,在升温速率为5 K/m in的DSC曲线上SD-33粘结剂从450.6℃开始分解放热,峰顶温度为456.6℃,结束温度为506.3℃,放热量为17.91 J/g。在320℃温度以下SD-33粘结剂具有良好的热稳定性。SD-33粘结剂热分解的活化能为154.91 kJ/m o l,指前因子为5.097×1010-s 1,机理函数为f(α)=(1-α)2。更多还原

【Abstract】 The thermal decomposition process of SD-33 bonder is studied by the DSC-TG curves with the rate of heating being 5 K/min,10 K/min,and 20 K/min respectively and the temperature range of 20～550℃,the thermal decomposition kinetics parameter and the mechanism function of SD-33 bonder are obtained by Coats-（Redfern） method.The results show that the initial temperatures of SD-33 bonder are approximately same,the final（temperatures） increase with the increasing heating rate of TG curves.At one time,the initial decomposition（temperature） of SD-33 bonder is 450.6℃,the top temperature is 456.6℃ and the enthalpy is 17.91 J/g on DSC curve having a rate of 5 K/min.The SD-33 bonder has good thermal stability when the temperature is lower than 320℃.The thermal decomposition activation energy of the SD-33 bonder is 154.91KJ/mol,the pre-exponential factor is 5.097×10¹⁰s^-1,and the mechanism function is f（α）=（1α）².更多还原