【摘要】 离子注入可作为前处理工艺辅助A l2O3陶瓷表面化学镀铜,优化了离子注入后以甲醛为还原剂、酒石酸钾钠为络合剂的碱性化学镀铜的基本配方。探讨了主盐浓度、甲醛、pH值、温度等对沉铜速度和镀层表面粗糙度的影响。研究了注入不同金属对沉铜速度的影响,结果表明注入铜比注入镍的化学镀铜速度快。更多还原

【Abstract】 Implanting ions can help electroless copper plating on the ceramics surface.The composition of alkaline electroless copper plating bath with formaldehyde as reducing agent and TART·K·Na as chelating agent pH valve after implanting ions on ceremics is optimized.The effect of main salt,fomaldehyde and temperature on copper depositing rate and copper layer roughness is analyzed.In addition,the effect of Cu and Ni ion implantation on plating rate is studied.The result shows that the plating rate of Cu ion implantation is faster that that of electroless copper plating.更多还原