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铜互连中SiCOF/a-C∶F双层低介电常数薄膜的制备和表征(英文)

Synthesis and Characterization of SiCOF/a-C∶F Double-Layer Films with Low Dielectric Constant for Copper Interconnects~*

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【作者】 张卫朱莲孙清清卢红亮丁士进

【Author】 Zhang Wei~,Zhu Lian, Sun Qingqing,Lu Hongliang, and Ding Shijin (Department of Microelectronics,Fudan University,Shanghai 200433,China)

【机构】 复旦大学微电子学系复旦大学微电子学系 上海200433上海200433

【摘要】 用等离子体化学气相淀积系统制备了一种新颖的SiCOF/a-C∶F双层低介电常数介质薄膜,并用红外光谱表征了该薄膜的化学结构.通过测量介质的折射率发现该薄膜长时间暴露在空气中,其光频介电常数几乎不变.然而,随退火温度的增加,其光频介电常数则会减小.基于实验结果讨论了几种可能的机理.二次离子质谱分析表明在Al/a-C∶F/Si结构中F和C很容易扩散到Al中,但在Al/SiCOF/a-C∶F/Si结构中,则没有发现C的扩散,说明SiCOF充当了C扩散的阻挡层.分析还发现在SiCOF和a-C∶F之间没有明显的界面层.

【Abstract】 A novel double-layer film of SiCOF/a-C∶F with a low dielectric constant is deposited using a PECVD system.The chemical structure of the film is characterized with Fourier transform infrared spectroscopy (FTIR).The measurements of the film refractive index reveal that the optical frequency dielectric constant (n~2) of the film is almost constant as a function of air exposure time,however,with increasing annealing temperature,the value of n~2 for the film decreases.Possible mechanisms are discussed in detail.The analysis of SIMS profiles for the metal-insulator-silicon structures reveal that in the Al/a-C∶F/Si structure,the annealing causes a more rapid diffusion of F in Al in comparison with C,but there is no obvious difference in Si.In addition,no recognizable verge exists between SiCOF and a-C∶F films,and the SiCOF film acts as a barrier against the diffusion of carbon into the aluminum layer.

【关键词】 低介电常数介质FTIRSI MS
【Key words】 low dielectric constant materialFTIRSIMS
【基金】 国家自然科学基金(批准号:60176013);上海先进材料研究发展基金(批准号:0304)资助项目~~
  • 【文献出处】 半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,2006年03期
  • 【分类号】TN304
  • 【被引频次】1
  • 【下载频次】151
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