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工艺参数对TiO2-Ag烧结体导电性的影响
Effect of Technical Parameter on the Conductivity of TiO2-Ag Agglomeration
【摘要】 用sol-gel法粉体技术制备TiO2粉,在TiO2粉体上用化学镀的方法制备了Ag为包覆层的复合导电粉体。测试TiO2-Ag复合导电粉体的体积电阻率,讨论了含银量、压力、煅烧温度对其体积电阻率的影响。试验结果表明,制备的粉体导电性能良好,且粉体烧结温度低。
【Abstract】 The nanometer TiO2 powder was prepared by sol-gel method. The compound conductive micro-powder with Ag coating layer on the TiO2 micro-powder was prepared by electroless plating. The volume resistivity of the TiO2-Ag compound powder was measured. The effect of the content of Ag, pressure and temperature on the conductivity of the compound micro-powder were discussed. The results indicate that the conductivity of the structure of Ag coating on TiO2 substrate have better conductivity and can be sintered at lower temperature.
【关键词】 复合导电材料;
粉体材料;
化学镀;
【Key words】 compound conductive material; powder material; electroless plating;
【Key words】 compound conductive material; powder material; electroless plating;
- 【文献出处】 半导体技术 ,Semiconductor Technology , 编辑部邮箱 ,2006年10期
- 【分类号】TM242
- 【下载频次】76