【摘要】 为了改善无铅焊料的润湿性,配置活性剂松香焊剂和无机物焊剂,研究了Sn-0.75Cu焊料的润湿性。分析讨论了影响Sn-0.75Cu焊料润湿性的主要因素,获得了焊剂和Sn-0.75Cu焊料的最优匹配。在镀锡铜片上,5#焊剂匹配Sn-0.75Cu焊料能够获得最佳的润湿性(润湿角为18°),已接近Sn-37Pb焊料的润湿性。更多还原

【Abstract】 In order to improve the wettability of lead-free solder,activated rosin fluxes and inorganic salt fluxes are prepared to study the wettability of Sn-0.75 Cu solder.The main influence factors are analyzed and discussed.As a result,on tin-plated copper substrate,inorganic halide activator rosin flux(No.5 flux) matching Sn-0.75 Cu solder can get the best wettability(the wetting angle is 18°),close to the wettability of Sn-37 Pb.更多还原