【摘要】 在滴胶过程中能够得到一致性较好的滴胶效果,是芯片粘接的基本要求。影响胶滴一致性的因素有很多,其中滴胶高度是否一致是最主要的影响因素之一。通过对Z轴的误差进行补偿使得滴胶高度保持一致,以消除其对滴胶一致性的影响。实验证明,通过这种方法补偿可以得到满足实验一致性要求的滴胶效果。更多还原

【Abstract】 Precise amount is a basic requirement in the process of die bonding. There are many factors that affect the dispensing amount, and the high of dispensing is one of the main factors. By compensating the error in Z axis, to keep the high of dispensing precision, so that avoid the effect to the dispensing amount. And the experiment had proved the way of compensation in Z axis is useful.更多还原