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冷轧低压电子铝箔退火加热过程中的再结晶和晶粒长大

Recrystallization and grain growth during annealing of cold rolled low voltage electronic aluminum foil

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【作者】 舒龙卫毛卫民冯惠平余永宁徐进

【Author】 SHU Long-wei, MAO Wei-min, FENG Hui-ping, YU Yong-ning, XU Jin (Department of Materials, University of Science and Technology Beijing, Beijing 100083, China)

【机构】 北京科技大学材料学系北京科技大学材料学系 北京100083北京100083北京100083

【摘要】 采用EBSD微取向分析、织构定量分析、晶粒尺寸分析等手段研究了低压电子铝箔不同退火加热过程对再结晶和晶粒长大行为的影响 ,并利用再结晶理论对相关过程进行了讨论。初次再结晶前的回复处理会明显降低冷轧铝箔的储存能及再结晶驱动力 ,并对再结晶晶粒尺寸和立方织构量产生规律性影响。特定的退火加热过程会诱发电子铝箔的晶粒异常长大 ,并导致立方织构量的明显下降。

【Abstract】 The influence of different annealing processes on the recrystallization and grain growth behaviors of low voltage electron aluminum foil was investigated using the quantitative texture analysis, EBSD micro orientation analysis, as well as grain size measurement. The corresponding processes were also discussed based on the current recrystallization theory. A recovery process before primary recrystallization will reduce the storage energy as well as the recrystallization driving force drastically, and therefore influence the recrystallization grain size and volume fraction of cube texture systematically. An abnormal grain growth process, connected with strong cube texture in electron aluminum foil, could be induced by certain special annealing treatment, which will decrease the volume fraction of cube texture obviously.

【基金】 北京市自然科学基金资助项目 ( 2 0 0 2 0 14 );北京市科学技术委员会资助项目 ( 95 5 0 310 40 0 )
  • 【文献出处】 中国有色金属学报 ,The Chinese Journal of Nonferrous Metals , 编辑部邮箱 ,2002年S1期
  • 【分类号】TG156.2
  • 【被引频次】17
  • 【下载频次】390
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