节点文献
立方织构Cu-Ni基带及缓冲层的研究
Cu-Ni Textured Tapes and Buffer Layer for HTS Coated Conductor
【摘要】 系统研究了Cu Ni合金基带和纯Ni基带的织构形成及转变规律 ,重复地获得了稳定的再结晶 { 0 0 1}<10 0 >立方织构。用表面氧化外延 (SOE)法生成了NiO(2 0 0 )薄膜。轧制总加工率、轧制道次和轧制方向对轧制织构的形成起主要作用 ;再结晶温度、时间是立方织构形成的主要影响因素。在获得了强立方织构Cu Ni合金基底上(其中Φ扫描曲线的半高宽 (FWHM)≤ 10°) ,通过SOE方法得到了取向良好NiO(2 0 0 )缓冲层
【Abstract】 A systematic study of texturing mechanism in pure Ni and Cu Ni alloys was presented. Sharp cube textured Cu Ni and pure Ni substrate could be obtained in a reproducible way after cold rolling and recrystallization. Meanwhile, a SOE method was used to form NiO(200) on the Cu Ni alloy substrate as a buffer layer. The results show that the rolling deformation, rolling pass and rolling direction take important roles in obtaining rolling texture. The recrystallization temperature and time are the main factors. The biaxially textured NiO layers are formed on Cu Ni alloy tapes which are highly {001}<100> textured substrates with FWHM(Full Width Half Maximum)≤10°.
【Key words】 Substrate; Cube texture; Surface oxidation epitaxy; Copper type; S component texture;
- 【文献出处】 稀有金属 ,Chinese Journal of Rare Metals , 编辑部邮箱 ,2002年03期
- 【分类号】TG335
- 【被引频次】4
- 【下载频次】125