【摘要】 采用离子束增强沉积 (IBED)铜过渡层和电子束蒸镀铜膜结合制备的单质膜结构 ,比采用电子束蒸镀钛 铜多层膜结构工艺简单 ,且不增加光刻腐蚀工艺难度 ,铜膜沉积于低表面粗糙度 (Ry≤ 0 .1μm )的氧化铝陶瓷基片表面获得了良好的膜 基附着力。实验证明 :IBED铜过渡层和电子束蒸镀铜膜结合的制膜方法是目前几种制造器件的工艺方法中最佳制膜工艺方法更多还原

【Abstract】 It is less complicated to make a simple material structure by the combination of IBED transition layer and EBD copper film than to make a multi layer Ti Cu film by EBD.Moreover, the combination of IBED and EBD wouldn’t make the next process of photo etching more difficult than EBD. Favorable adhesion can be realized by depositing copper film on the alumina ceramics that has low surface roughness( Ry ≤0.1 μm). Experiments show that the method using the IBED transition copper layer combined with EBD copper film is the best technology among the film fabrication technologies popularly used at present.更多还原