【摘要】 目的 :了解增益型银汞合金黏结剂 (SuperBondDLinerPlus,SBDLP)修复时银汞合金黏结剂(简称A界面 )和牙本质黏结剂 (简称D界面 )界面的黏结性能 ,以及前者的黏结机制。方法 :以拉力试验机测试剪切黏结强度 ;扫描电镜 (SEM)和能谱分析 (EDS)观察二界面有效黏结面积、密合度和微观结构。结果 :剪切黏结强度平均为 2 6.70± 9.5 3MPa ,最大值 3 8.78MPa ;A界面与D界面平均有效黏结面积比为 1.2 3∶ 1。电镜显示纵剖面标本黏结银汞二界面均无微间隙 ,A界面银汞合金与黏结剂形成相互混杂结构带。能谱分析也证实此结构带中二类物质的元素分布态势。结论 :SBDLP在银汞合金与黏结剂界面形成的相互混杂嵌锁结构是银汞合金黏结的可能机制更多还原

【Abstract】 AIM:To assess the bond strength and adhesive mechanism at the amalgam-adhesive and dentin-adhesive interface and the adhesive mechanism at the amalgam-adhesive interface of Super Bond D Liner Plus (SBDLP) bonded amalgam restoration. METHODS:Shera bond strength was measured by a universal testing machine. After sectoning of class I bonded amalgam restoration on molars, SEM and EDS were used for examination of the active area of adhesion and adaptability (sealing property) at amalgam-adhesive and dentin-adhesive interface. RESULTS: The average shear-bond strength was 26.70±9.53 Mpa. The highest value was 38.78 Mpa and the ratio of average active area of adehesion between amalgam-adhesive and dentin-adhesive interface was 1.23∶ 1. SEM revealed no microgap at both interface of bonded restoration. There is a distinct intermingle layer at the almagam-adhesive interface, which was further identified by EDS. CONCLUSION:The results revealed that the interloking strucmre of almagam and adhesive resin in intermingle layer formed at amalgam-adhesive interface is the possible mechanism of amalgam bonging.更多还原