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电真空器件用贵金属钎料溅散性影响因素
Influence Factors on the Spatter Property of Precious Metals Filler Metals for Electronics Vacuum Device
【摘要】 对电真空钎料溅散性的各种影响因素进行分析对比 .结果表明 ,影响电真空钎料溅散性的主要原因是原料中含有氧、回炉料中含有CuO和Cu2 O ;采用 2~ 3次高真空重熔是解决电真空器件用贵金属钎料溅散性问题的根本方法
【Abstract】 Different influence factors on the spatter property of the electronics vacuum filler metals have been analysed and contrasted.It has been shown that oxygen in the raw materials and CuO (Cu 2O) in the scrap are the main reasons.Two or Three times re melting under high vacuum is the basic way to solve the spatter problem.
- 【文献出处】 云南大学学报(自然科学版) ,Journal of Yunnan University (Natural Sciences) , 编辑部邮箱 ,2002年S1期
- 【分类号】TN105
- 【被引频次】4
- 【下载频次】148