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Al合金与复合材料LID连接接头微观结构分析
Microstructure Analysis of LID Bonds of Al-alloy and Composite Material
【摘要】 通过SiC颗粒增强Al基复合材料与Al合金的液相界面扩散 (LID)连接试验 ,重点研究了连接接头区域的微观组织 ,并简要分析了接头中各元素的浓度分布情况。结果表明 ,LID连接Al基复合材料和Al合金形成的界面明显向Al合金一侧偏移 ,并且溶质原子在界面两侧分布存在明显的不对称现象。研究结果为异种材料的连接提供了重要的科学依据
【Abstract】 Microstructure of LID bonding area and concentration profile of the bonds are studied through the LID bonding tests of SiC particle reinforced Al based composite and aluminium alloy.Experimental results show that the bond interface departures from original central line to aluminium alloy in the LID bonds of Al based composite and aluminium alloy, and solute atoms distribute fairly asymmetrically around the joint area. The study provides a scientific basis for bonding of the dissimilar materials.
【关键词】 异种材料;
液相界面扩散连接;
中间层;
微观结构;
【Key words】 Dissimilar material; LID bonding; Interlayer; Microstructure;
【Key words】 Dissimilar material; LID bonding; Interlayer; Microstructure;
- 【文献出处】 宇航材料工艺 ,Aerospace Materials & Technology , 编辑部邮箱 ,2002年05期
- 【分类号】TB33
- 【下载频次】54