【摘要】 用热压烧结法工艺制备碳化硅片晶增强 BAS(Ba OAl2 O3 2 Si O2 )玻璃陶瓷基复合材料(Si Cpl- BAS) ,并对其组织结构与力学性能进行了研究 .结果表明 ,当碳化硅片晶体积分数达到 0 .3 0时 ,Si Cpl- BAS复合材料的断裂韧性和抗弯强度分别从纯基体的 1 0 0 .3 MPa和 1 .49MPa·m1/ 2 ,提高到 1 81 .0 MPa和 3 .2 0 MPa· m1/ 2 .主要的增强增韧机理为裂纹的偏转、分岔和片晶的拔出更多还原

【Abstract】 Ultra fine BAS glass ceramic powders were prepared by Sol gel processing and SiC platelets (SiC pl ) reinforced BAS matrix composites were fabricated by hot pressing. The results of microstructure analysis and mechanical properties measurements show that by addition of the SiC platelet, the flexural strength and fracture toughness values of the composites can be effectively improved, and the relative densities of composites be decreased slightly. Strengthening and toughening mechanisms of the materials in the text are load transfer, deflexion and divarication, SiC platelet pulling out.更多还原