【摘要】 在真空不低于 1 5× 1 0 -3 Pa ,温度为 6 0 0℃ ,压强为 30MPa,保温 2h的条件下进行了Si3 N4 /Al的扩散连接。微观分析表明 ,连接的Si3 N4 /Al的界面两侧存在Si和Al原子有限的相互扩散。界面断裂力学实验证实 ,Si3 N4 /Al连接界面的断裂机制为脆性剥离更多还原

【Abstract】 Si 3N 4/Al/Si 3N 4 sandwich specimens were bonded by using a vacuum diffusion bonding technology,with the parameters of 1.5×10 -3Pa,600℃,30MPa and 2h.Microanalyses show that a limited Si and Al atom diffusion happens across Si 3N 4/Al interface,and the experiments of interface fracture mechanics proved that Si 3N 4/Al interface fracture resulted from brittle debonding.更多还原