【摘要】 研究了化学镀铅锡合金过程中各影响因素对镀层的组成和厚度的影响。施镀过程在 pH =7.0 ,6 0～70℃的条件下进行 ,用Na2 CO3 作为pH调节剂 ,化学镀槽液组成为 :Pb2 + 0 .0 0 1mol/L ,Sn2 + 0 .0 75～ 0 .0 80mol/L ,EDTA 0 .0 7～ 0 .10mol/L ,柠檬酸钠 0 .0 8～ 0 .12mol/L ,辅助络合剂 0 .2mol/L ,还原剂 0 .0 15～ 0 .0 5 0mol/L。该条件下得到了光亮的铅锡合金镀层。并对化学镀成膜机理及各影响因素等作了初步探讨。更多还原

【Abstract】 Effects of conditions of electroless plating of Pb Sn alloy on the composition and thickness of the coating were studied. Deposition proceeded under moderate conditions of pH 7.0 and 60～70℃, employing sodium carbonate as a pH controller. Basic bath compositions were Pb 2+ 0.001mol/L, Sn 2+ 0.075～0.080mol/L, disodium EDTA 0.07～0.10mol/L, trisodium citrate 0.08～0.12mol/L, auxiliary complex 0.2mol/L, reductant 0.015～0.050mol/L. Bright Pb Sn alloy coating was obtained and the affecting factors were discussed.更多还原