【摘要】 在用回流焊料凸点时,常会发生凸点的桥接现象,致使芯片报废。此时,相邻的多个凸点彼此融合,聚集成一个更大的焊料球,并吸干先前各凸点中的焊料。本文研究了电镀PbSn凸点和蒸发铟凸点的回流过程中出现的桥接现象。介绍了桥接现象产生的过程及其背景,分析了桥接现象的机理,提出了改进措施。更多还原

【Abstract】 Bridge joints caused by solder bumps in reflow soldering may result in chip failure. In reflow soldering, adjacent bumps may form a big ball when they are melted. The formation of bridge joints caused by electroplated Pb/Sn bumps and evaporated indium bumps in reflow soldering was investigated. The technical conditions resulting in the formation of the bridge joints and the formation mechanism are analyzed, and a method is proposed to avoid the failure.更多还原