【摘要】 研究了镀液pH值对Ni-P和Ni -Mo -P化学镀镀层的生成速度和镀层中Ni质量分数的影响 .结果表明 ,镀液的pH值不仅影响Ni的沉积速度 ,而且影响镀层中Ni的质量分数 ;镀层生成速度均随镀液pH值增大而出现极大值 ,但两者的位置有所不同 ;随镀液pH值增加 ,Ni-Mo -P镀镀层中w(Ni)出现极大值 ,而Ni-P镀则是pH值增至一定值后w(Ni)趋于平稳 ;镀层的生成速度与镀层中w(Ni)的最高点都出现在相同的酸度下 ,Ni -P镀镀液的最佳pH值为 5 .5 ,而Ni-Mo -P镀镀液的最佳pH值为 6.5 .更多还原

【Abstract】 The effects of acidity on Ni-P and Ni-Mo-P chemical plating were studied. The results showed that the acidity of plating solution places an important role in both the Ni-P and Ni-Mo-P chemical plating. The pH value affects both the formation speed of cladding and the Ni content in it. The rate of cladding formation has a maximum as the acidity of plating solution decreases in both the Ni-P and the Ni-Mo-P chemical plating process, but at different pH values. The nickel content in the cladding has a maximum too in both the Ni-P and the Ni-Mo-P chemical plating process. It is also found that the deposit speed and the most Ni content appeared at the same acidity either for Ni-P or Ni-Mo-P chemical plating. The optimum pH is around 5.5 for Ni-P chemical plating and 6.5 for Ni-Mo-P chemical plating.更多还原